Description
Perfluoropolyether fluids are specialized PFPE products characterized by a low degree of polymerization, low molecular weight, low boiling point, and low viscosity.
Compared to other fluorinated fluids on the market—such as hydrofluoroethers (HFEs), hydrofluorocarbons (HFCs), perfluorocarbons (PFCs), and perfluoroketones—this product offers superior chemical stability and is more environmentally friendly than traditional perfluorocarbons.
Liquid Cooling
Designed for data center server cooling and immersion liquid cooling. It eliminates the need for air conditioning, significantly reducing facility power consumption. With a PUE controlled below 1.1, it delivers over 85% energy savings compared to traditional air-cooling systems.
Electronic Testing Fluid
Suitable for reliability testing in the semiconductor and electronics industries, including thermal shock and hermetic seal (airtightness) testing.
Electronic Cleaning Fluid
This fluorinated fluid is colorless, odorless, and non-toxic. Featuring low surface tension and high permeability, it delivers exceptional cleaning performance on minute particles and stubborn contaminants. It serves as a specialized cleaning fluid for electronic components and printed circuit boards (PCBs).
Heat Transfer Fluid
Widely used in the semiconductor, electronics, fuel cell, and solar industries. It is primarily utilized to control or maintain process temperatures at designated target levels, effectively eliminating the potential risk of material damage.
Vapor Phase Soldering Fluid
Utilizes the latent heat of condensation from fluorinated fluid vapor to melt solder paste, ensuring reliable metallic joints. Featuring a narrow boiling range for more precise temperature control, its high boiling point perfectly accommodates the elevated operating temperatures required for lead-free soldering.
Acid Spill Treatment
Characterized by chemical inertness, strong hydrophobicity, high density (lower than fuming sulfuric acid), and non-flammability. Completely incompatible with fuming sulfuric acid, it serves as an effective continuous blanketing/covering material to mitigate fuming sulfuric acid and sulfuric acid spills.
Parameter
| Fluorinated Fluids | Unit | HR100 | HR140 | HR175 | HR180 |
| Boiling Point | ℃ | 94 | 143 | 200 | 181 |
| Pour Point | ℃ | -100 | -97 | -85 | -95 |
| Density @ 25℃ | g/cm3 | 1.66 | 1.74 | 1.78 | 1.77 |
| Density @ -54℃ | g/cm3 | 1.91 | 1.95 | 1.96 | 1.95 |
| Kinematic Viscosity @ 25℃ | cSt | 0.6 | 1.1 | 3.3 | 3.1 |
| Kinematic Viscosity @ -54℃ | cSt | 10.1 | 11.2 | 160 | 70 |
| Vapor Pressure @ 25℃ | kPa | <7 | <0.8 | <0.3 | <0.3 |
| Specific Heat @ 25℃ | J/Kg°C | 970 | 970 | 970 | 970 |
| Heat of Vaporization @ Boiling Point | J/g | 67 | 67 | 67 | 67 |
| Thermal Conductivity @ 25℃ | W/m-°C | 0.07 | 0.07 | 0.07 | 0.07 |
| Expansion Coefficient | °C-1 | 0.0012 | 0.0012 | 0.0012 | 0.0012 |
| Surface Tension @ 25℃ | dynes/cm | 12.2 | 13.1 | 15 | 14.5 |
| Dielectric Strength @ 25℃ | kV – 2.54mm gap | 40 | 40 | 40 | 40 |
| Dielectric Constant @ 25℃ (1kHz) | <2 | <2 | <2 | <2 | |
| Dissipation Factor @ 25℃ (1kHz) | <0.01 | <0.01 | <0.01 | <0.01 | |
| Volume Resistivity @ 25℃ | Ohm·Cm | 6×1015 | 6×1015 | 6×1015 | 6×1015 |
| Water Solubility | ppm(wt) | <30 | <30 | <30 | <30 |
| Air Solubility | cm3gas/100Cm3 | 26 | 26 | 26 | 26 |
| Molecular Weight | ~470 | ~650 | ~850 | ~800 | |
| ODP | 0 | 0 | 0 | 0 | |
| Reactivity | Does not react with strong acids, strong alkalis, and strong oxidants | ||||
| Thermal Decomposition Temperature | ℃ | >290 | >290 | >290 | >290 |
